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Special Cooling Applications (471)
Chapter Outline
Chapter 11 - Special Cooling Applications (Cooling Methods for Electronics Design)
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Advanced Cooling Techniques
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Boiling Dielectric Liquid System
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Thermal Electric Cooler
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Semi-Passive Thermosyphon
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Semi-Passive Falling Films
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Simulated Electronic Chips in Dielectric Liquid
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Pool Boiling
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Flow Boiling
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Liquid Jet or Spray Cooling w/ Boiling
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Micro and Mini Channel Cooling: Simulated Electronic Chips with Attached Heat Sink
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Introduction to Heat Pipes
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Why a heat pipe works
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Heat pipe sinks for electronic component cooling
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Fluid Compatibility
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Field experience
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Constant-conductance heat pipe
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Types of groove and wick configurations
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Diode heat pipe types
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Liquid trap
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Liquid blockage
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Gas blockage
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Variable-conductance heat pipes (VCHPs)
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Capillary pumped loop (CPL)
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Comparison of VCHP and CPL performance
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Analysis: Heat pipe capacity
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System pressure drop
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Thermodynamic considerations
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Working fluids, compatibility
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Testing, applications, performance, references
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Experimental investigation of micro heat pipes fabricated in silicon wafers
Video Outline
Special Cooling Applications (Heat Pipes, Liquid Cooling, Thermal Electric Coolers)