Electronic Cooling Design Techniques: Components (471)

Chapter Outline

Chapter 8 - Electronic Cooling Design Techniques: Components (Cooling Methods for Electronics Design)

  • Electronic Component Descriptions
    • Discrete vs. Integrated Circuit
    • Active vs. Passive
  • Component Packaging
    • Lead Configurations
    • Purposes of package configuration
  • Component-to-PCB Mounting Methods
  • Thermal Specifications of Component Packages
  • Junction-to-Ambient Thermal Resistance (qJA)
    • Measurement Technique
    • Measurement set-ups
  • Junction-to-Case Thermal Resistance (qJC)
  • Junction-to-Board Thermal Resistance (qJB)
  • Parameters Affecting Thermal Performance

Video Outline

Electronic Cooling Design Techniques—Components