Conduction Heat Transfer (471)

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Chapter Outline

Heat flows through a solid
Addition of Thermal Resistances
- Series
- Parallel
- Combination
Factors affecting Joint Thermal Resistance
- Roughness
- Pressure
Improving conduction: Metal foils, shims, thermal grease,
Effect of contact pressure and area
Contact resistance, minimizing; Example
Heat Sinks and Heat Exchangers
Properties of Thermal Plane Materials
Thermal wedge clamp; Example
Surface Mount PC Board Assembly
Metal core PC boards; materials; determining IC case to board core resistance
Thermal paths, thru-hole vias
Amplifier internal heat sinking
Thermal conductivity of
- Substrate materials
- IC packaging materials
- Adhesives
Thermal spread angle; values for common materials; Example
Diamond heat sinks